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Title:The Internet of Things Communication Protocol for Devices with Low Memory Footprint
Authors:ID Vinkovič, Sašo (Author)
ID Ojsteršek, Milan (Author)
Files:URL http://www.inderscience.com/info/ingeneral/forthcoming.php?jcode=ijahuc
 
Language:English
Work type:Not categorized (r6)
Typology:1.01 - Original Scientific Article
Organization:FERI - Faculty of Electrical Engineering and Computer Science
Abstract:This paper describes a new communication protocol named XMC which is designed for the transmission of messages between an embedded device and a remote system. A new markup language called XMDD has also been developed and is used to describe the functional profile of the embedded device. The main advantage of the XMC communication protocol is its flexibility and independence from the device type. It is suitable for communication with devices that have a curtailed amount of working memory (a few kB) and limited computing power, i.e. 8-bit or 16-bit microcontrollers. Messaging between the embedded device and the remote systems is done without any interference with the basic source code of the embedded device, thus allowing access to all functionalities and features of the connectable embedded device and is based on the functionality dictionary and built-in features of an embedded device. It also maintains a low production price for the embedded device and from the programming point of view provides a transparent and flexible upgrade of the hardware and software without any redundancy input.
Keywords:communication protocol, internet of things, home automation, functional profile, smart appliance, code generation, embedded system, framework
Publication status in journal:In print
Article version:Postprint, final article version, accepted into publication
Number of pages:12
PID:20.500.12556/DKUM-47124 New window
COBISS.SI-ID:18435606 New window
NUK URN:URN:SI:UM:DK:DERMBIMY
Publication date in DKUM:21.12.2014
Views:1952
Downloads:100
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Categories:Misc.
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Record is a part of a journal

Title:International Journal of Ad Hoc and Ubiquitous Computing
Publisher:Inderscience
ISSN:1743-8225

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